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 Preliminary Datasheet
RJE0601JPE
Silicon P Channel MOS FET Series Power Switching
Description
This FET has the over temperature shut-down capability sensing to the junction temperature. This FET has the built-in over temperature shut-down circuit in the gate area. And this circuit operation to shut-down the gate voltage in case of high junction temperature like applying over power consumption, over current etc.. REJ03G1906-0200 Rev.2.00 Jun 29, 2010
Features
High endurance capability against to the short circuit. Built-in the over temperature shut-down circuit. Latch type shut down operation (need 0 voltage recovery). Built-in the current limitation circuit. Low on-resistance RDS: 22 m Typ, 27 m Max (VGS = -10 V)
Outline
RENESAS Package code: PRSS0004AE-B (Package name: LDPAK (S)-(1) )
D
G 1 2 3
Temperature Sensing Circuit
Gate Resistor
Current Limitation Circuit
Gate Shut-down Circuit
1. Gate 2. Drain (Flange) 3. Source
Latch Circuit
S
Absolute Maximum Ratings
(Ta = 25C)
Item Symbol Drain to source voltage VDSS Gate to source voltage VGSS Gate to source voltage VGSS Drain current ID Body-drain diode reverse drain current IDR Avalanche current IAP Note 1 Avalanche energy EAR Note 2 Channel dissipation Pch Note 1 Channel temperature Tch Storage temperature Tstg Notes: 1. Value at Tc = 25C 2. Tch = 25C, Rg 50 3. It provides by the current limitation lower bound value. Ratings -60 -16 2.5 -40 Note 3 -40 -15 964 50 150 -55 to +150 Unit V V V A A A mJ W C C
REJ03G1906-0200 Rev.2.00 Jun 29, 2010
Page 1 of 6
RJE0601JPE
Preliminary
Typical Operation Characteristics
(Ta = 25C)
Item Input voltage Input current (Gate non shut down) Input current (Gate shut down) Shut down temperature Gate operation voltage Drain current (Current limitation value) Notes; 4. Pulse test Symbol VIH VIL IIH1 IIH2 IIL IIH(sd)1 IIH(sd)2 Tsd Vop ID limt Min -3.5 -- -- -- -- -- -- -- -3.5 -40 Typ -- -- -- -- -- -0.8 -0.35 175 -- -60 Max -- -1.2 -100 -50 -1 -- -- -- -12 -- Unit V V A A A mA mA C V A Test Conditions
Vi = -8 V, VDS = 0 Vi = -3.5 V, VDS = 0 Vi = -1.2 V, VDS = 0 Vi = -8 V, VDS = 0 Vi = -3.5 V, VDS = 0 Channel temperature (dv/dt VGS 500 V/ms) VGS = -12 V, VDS = -10 V Note 4
Electrical Characteristics
(Ta = 25C)
Item Drain current Symbol ID1 ID2 ID3 V(BR)DSS V(BR)GSS V(BR)GSS IGSS1 IGSS2 IGSS3 IGSS4 IGS(OP)1 IGS(OP)2 IDSS VGS(off) |yfs| RDS(on) RDS(on) Coss td(on) tr td(off) tf VDF trr tos1 Min -- -- -40 -60 -16 2.5 -- -- -- -- -- -- -- -2.2 8.4 -- -- -- -- -- -- -- -- -- -- Typ -- -- -60 -- -- -- -- -- -- -- -0.8 -0.35 -- -- 27 26 22 860 12.6 12.5 3.7 2.2 -0.95 100 2.3 Max -40 -10 -- -- -- -- -100 -50 -1 100 -- -- -10 -3.4 -- 45 27 -- -- -- -- -- -- -- -- Unit A mA A V V V A A A A mA mA A V S m m pF s s s s V ns ms Test Conditions VGS = -3.5 V, VDS = -10 V VGS = -1.2 V, VDS = -10 V VGS = -12 V, VDS = -10 V Note 5 ID = -10 mA, VGS = 0 IG = -800 A, VDS = 0 IG = 100 A, VDS = 0 VGS = -8 V, VDS = 0 VGS = -3.5 V, VDS = 0 VGS = -1.2 V, VDS = 0 VGS = 2.4 V, VDS = 0 VGS = -8 V, VDS = 0 VGS = -3.5 V, VDS = 0 VDS = -60 V, VGS = 0 VDS = -10 V, ID = -1 mA ID = -20 A, VDS = -10 V Note 5 ID = -20 A, VGS = -6 V Note 5 ID = -20 A, VGS = -10 V Note 5 VDS = -10 V, VGS = 0, f = 1MHz VGS = -10 V, ID= -20 A, RL = 1.5
Drain to source breakdown voltage Gate to source breakdown voltage Gate to source leak current
Input current (shut down) Zero gate voltage drain current Gate to source cutoff voltage Forward transfer admittance Static drain to source on state resistance Output capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body-drain diode forward voltage Body-drain diode reverse recovery time Over load shut down Note 6 operation time
IF = -40 A, VGS = 0 IF = -40 A, VGS = 0 diF/dt = 50 A/s VGS = -5 V, VDD = -16 V
Notes: 5. Pulse test 6. Including the junction temperature rise of the over loaded condition.
REJ03G1906-0200 Rev.2.00 Jun 29, 2010
Page 2 of 6
RJE0601JPE
Preliminary
Main Characteristics
Power vs. Temperature Derating
80 -1000
Maximum Safe Operation Area
Ta = 25C Thermal shut down operation area
Channel Dissipation Pch (W)
Drain Current ID (A)
60
-100
1 m s
40
-10
DC Operation (Tc = 25C) Operation in this area is limited RDS(on)
20
-1
PW = 10 ms
0 0 50 100 150 200
-0.1 -0.1
-1
-10
-100
Case Temperature Tc (C)
Drain to Source Voltage VDS (V)
Typical Output Characteristics
-100 Pulse Test -40
Typical Transfer Characteristics
VDS = -10 V Pulse Test
Drain Current ID (A)
Drain Current ID (A)
-10 V -50
-8 V -6 V
-30
-5.5 V -5 V -4.5 V VGS = -4 V
-20
Tc = 75C 25C -25C
-10
0
-5
-10
-0 0 -2 -4 -6 -8 -10
Drain to Source Voltage VDS (V) Drain Source Saturation Voltage vs. Gate to Source Voltage
Drain to Source Saturation Voltage VDS(on) (mV)
-2000 Pulse Test
Gate to Source Voltage VGS (V) Static Drain to Source On State Resistance vs. Drain Current
1000 Pulse Test
-1500
Static Drain to Source On State Resistance RDS(on) (m)
100 VGS = -6 V 10 -10 V
-1000
-500
-5 A
ID = -20 A -10 A
0
-2
-4
-6
-8
-10
-12
1 -0.1
-1
-10
-100
Gate to Source Voltage VGS (V)
Drain Current ID (A)
REJ03G1906-0200 Rev.2.00 Jun 29, 2010
Page 3 of 6
RJE0601JPE
Static Drain to Source On State Resistance vs. Temperature
Forward Transfer Admittance |yfs| (S)
50 Pulse Test 40 ID = -20 A -10 A -5 A 100 Tc = -25C 10 25C 1 75C
Preliminary
Forward Transfer Admittance vs. Drain Current
Static Drain to Source On State Resistance RDS(on) (m)
30
VGS = -6 V
ID = -20 A -10 A, -5 A
20 -10 V 10 -50 -25 0 25
50
75 100 125 150
0.1 -0.1
VDS = -10 V Pulse Test -1 -10 -100
Case Temperature Tc (C)
Drain Current ID (A)
Body-Drain Diode Reverse Recovery Time
1000
Switching Characteristics
100 VGS = -10 V, VDD = -30 V PW = 300 s, duty 1 %
Reverse Recovery Time trr (ns)
Switching Time t (s)
td(on) 10
tr
100
td(off)
10 -0.1
di / dt = 50 A /s VGS = 0, Ta = 25C -1 -10 -100
tf 1 -0.1 -1 -10 -100
Reverse Drain Current IDR (A) Typical Capacitance vs. Drain to Source Voltage
10000
Drain Current ID (A) Reverse Drain Current vs. Source to Drain Voltage
-40
Reverse Drain Current IDR (A)
VGS = 0 f = 1 MHz
Pulse Test -30 -10 V -20 -5 V -10 VGS = 0 V 0 -0.5 -1.0 -1.5
Capacitance C (pF)
1000 Coss
100 -0
-10
-20
-30
-40
-50
-60
Drain to Source Voltage VDS (V)
Source to Drain Voltage VSD (V)
REJ03G1906-0200 Rev.2.00 Jun 29, 2010
Page 4 of 6
RJE0601JPE
Gate to Source Voltage vs. Shutdown Time of Load-Short Test
Preliminary
Shutdown Case Temperature vs. Gate to Source Voltage
Gate to Source Voltage VGS (V)
-12 -10 -8 -6 -4 -2 0 0.0001
Shutdown Case Temperature Tc (C)
200
180
160
VDD = -16 V
140 ID = -5 A dv/dt VGS 500 V/ms 0 -2 -4 -6 -8 -10
120 100
0.001
0.01
0.1
Shutdown Time of Load-Short Test Pw (S)
Gate to Source Voltage VGS (V)
Normalized Transient Thermal Impedance s (t)
Normalized Transient Thermal Impedance vs. Pulse Width
10
1
D=1
0.5 0.2
0.1
0.1
ch - c(t) = s (t) x ch - c ch - c = 2.5C/W, Tc = 25C
PDM
0.02
0.01
1sh ot p
D=
PW T
PW T
ulse
0.01 0.00001
0.05
0.0001
0.001
0.01
0.1
1
10
Pulse Width PW (S) Switching Time Test Circuit
Vin Monitor D.U.T. RL VDD = -30 V Vout td(on) Vout Monitor Vin 10% 90% 90% 90%
Waveform
Vin -10 V
50
10% tr td(off)
10% tf
REJ03G1906-0200 Rev.2.00 Jun 29, 2010
Page 5 of 6
RJE0601JPE
Preliminary
Package Dimensions
Package Name LDPAK(S)-(1) JEITA Package Code SC-83 RENESAS Code PRSS0004AE-B Previous Code LDPAK(S)-(1) / LDPAK(S)-(1)V MASS[Typ.] 1.30g
Unit: mm
4.44 0.2 10.2 0.3
(1.4)
8.6 0.3
+ 0.3 - 0.5
10.0
(1.5)
(1.5)
2.49 0.2 0.2 0.1 + 0.1 -
7.8 7.0
2.2
1.37 0.2 1.3 0.2 2.54 0.5
0.3 3.0 + 0.5 -
0.2 0.86 + 0.1 -
0.4 0.1
2.54 0.5
Ordering Information
Part No. RJE0601JPE-00-J3 Quantity 1000 pcs Taping Shipping Container
REJ03G1906-0200 Rev.2.00 Jun 29, 2010
1.7
1.3 0.15
7.8 6.6
Page 6 of 6
Notice
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You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. 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